Roof sealed for main structure of SMIC’s fab in Wuhan
Written by Administrator
Friday, 27 April 2007
BEIJINNG, April 27 (InfoChina) – Roof was sealed for the main structure of Semiconductor Manufacturing International Corporation (SMIC, NYSE: SMI, HK: 981)’s fab in Wuhan on April 26, indicating central China’s first 12-inch 90 mm IC production line will come on stream in the first quarter of 2008.
The fab, involving a total investment of 10 billion yuan and covering an area of 48,000 square meters, is jointed financed by the Hubei provincial government, Wuhan City government and Wuhan East Lake New Technology Development Zone. SMIC is engaged to manage the fab that is scheduled for completion by the end of 2007.
The fab will focus on production of memory chips. Its monthly capacity is expected to reach 21,000 12-inch wafers in 2009.
An insider in charge said that so far the fab has got full order books until 2009. (Edited by Yang Liu,
)